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FR 1,27/ 6-FH
1337009
PHOENIX_CONTACT
560
SMD plug plug, rated current: 2.2 A, test voltage: 500 VAC, number of poles: 6, pitch: 1.27 mm, color: black, surface contacts: Gold, contact type: Female, mounting: SMD solder
SMD female connector, nominal current: 2.2 A, Test voltage: 500 V AC, number of positions: 6, pitch: 1.27 mm, color: black, contact surface: Gold, contact connection type: Socket, mounting: SMD soldering
PCB Connectors (PCC)
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Product type | SMD female connector |
Product family | FR 1,27/..-FH |
Number of positions | 6 |
Pitch | 1.27 mm |
Number of rows | 2 |
Pin layout | Linear pad geometry |
Nominal current IN | 2.2 A IEC 60512-5-2:2002-02 (at 20°C 100-pos.) |
Degree of pollution | 3 |
Contact resistance | 10 mΩ |
Test voltage | 500 V AC IEC 60512-4-1:2003 |
Mounting type | SMD soldering |
Pin layout | Linear pad geometry |
Processing notes | |
Process | Reflow soldering |
Moisture Sensitive Level | MSL 1 |
Classification temperature Tc | 260 °C |
Solder cycles in the reflow | 3 |
Material data - contact | |
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact material | Cu alloy |
Surface characteristics | Selective coating |
Metal surface contact area (top layer) | Gold (Au) |
Metal surface contact area (middle layer) | Nickel (Ni) |
Metal surface soldering area (top layer) | Tin (Sn) |
Metal surface soldering area (middle layer) | Nickel (Ni) |
Material data - housing | |
Color (Housing) | black (9005) |
Insulating material | LCP |
Insulating material group | IIIb |
CTI according to IEC 60112 | 150 |
Flammability rating according to UL 94 | V0 |
Cross section AWG | (converted acc. to IEC) |
Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
Dimensional drawing | |
Pitch | 1.27 mm |
Width [w] | 8.9 mm |
Height [h] | 4.53 mm |
Length [l] | 10.8 mm |
Installed height | 3.78 mm |
Application | |
Contact cover | 0.9 mm |
Center offset | ± 0.7 mm in longitudinal and transverse direction |
Wipe length | 1.5 mm |
Angular tolerance | ± 5 ° in longitudinal and transverse direction |
PCB design | |
Pad geometry | 0.8 x 0.8 mm |
Thermal test | Test group C | |
Specification | IEC 60512-5-2:2002-02 |
Insulation resistance | |
Specification | IEC 60512-3-1:2002-02 |
Insulation resistance, neighboring positions | ≥ 5 GΩ |
Air clearances and creepage distances | | |
Insulating material group | IIIb |
Minimum value for clearance and creepage distance | 0.4 mm |
Vibration test | |
Specification | IEC 60068-2-6:2007-12 |
Frequency | 10 - 2000 - 10 Hz |
Sweep speed | 1 octave/min |
Amplitude | 1.5 mm (10 Hz ... 58 Hz) |
Sweep speed | 200 m/s² (58 Hz ... 2000 Hz) |
Test duration per axis | 2.5 h |
Durability test | |
Specification | IEC 60512-9-1:2010-03 (following) |
Contact resistance R1 | 10 mΩ |
Contact resistance R2 | 15 mΩ |
Insertion/withdrawal cycles | 500 |
Insulation resistance, neighboring positions | ≥ 5 GΩ |
Shocks | |
Specification | IEC 60068-2-27:2008-02 |
Pulse shape | Semi-sinusoidal |
Acceleration | 490 m/s² |
Shock duration | 11 ms |
Test directions | X-, Y- and Z-axis (pos. and neg.) |
Ambient conditions | |
Ambient temperature (operation) | -55 °C ... 125 °C |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Dimensional drawing | |
Type of packaging | 24 mm wide tape |
[W] tape width | 24 mm |
[W2] coil overall dimension | 30.4 mm |
[A] coil diameter | 330 mm |
Outer packaging type | Transparent-Bag |
ESD level | (D) electrostatically conductive |
Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Title: | Size: | Type: |
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PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
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